Uniform heat for 300mm wafer IR

Mon, 01 Jun 2026 18:11:53 +0800

On a 300mm line, the photoresist bake is where you lock in the thermal budget. A hot or cold edge, a drift during hard bake, and your CD uniformity falls apart—scrap stacks up while the scheduler keeps pushing the same lot. We built the 300mm wafer IR heating module to take that variability out of the equation. What actually matters Getting uniform heat across a 300mm wafer starts with a short-wave infrared emitter array and a quartz-based thermal design that holds wafer-level uniformity within ±0.1°C across the entire surface. Temperature ramps are repeatable, so soft bake and hard bake profiles track the recipe exactly, batch after batch. The module runs in Class 1–100 cleanrooms without adding particles—sealed emitters, inert quartz paths, and cleanroom-compatible fixtures keep particle generation at zero. Here is why this matters in lithography: the bake isn’t just heating, it’s process control. The module holds setpoint under 7×24 operation with no unplanned downtime, so you can run continuous lots without thermal drift. The payoff is stable CDs, fewer reworks, and yields you can plan around. It also happens to be efficient—emitter arrays heat only the target area with fast response, and the long service interval keeps maintenance windows tight. A few practical notes before you spec it in. The module integrates into existing tracks and bake plates, but it needs a dedicated power circuit and verified coolant temperature stability at the interface. Matching the thermal mass of your carrier and bake plate is non-negotiable; even a small mismatch shows up as edge-to-edge variation. Get the mechanical envelope and cleanroom clearances nailed down up front, and it will run exactly as specified.

300mm on Cutting-Edge IR Heating Technology

Uniform heat for 300mm wafer IR